Bluetooth Audio SoC
Actions Bluetooth headset chip series products are mainly dual-mode Bluetooth 5.3 single-chip solutions, featuring high sound quality, low latency, and low power consumption. They are mainly used in the true wireless stereo headset (TWS), neck-mounted headsets, headphones, and other wearable audio devices. Actions Technology specializes in providing high-quality and low-latency wireless audio experience under the premise of low power consumption. The series of products have Bluetooth transmission power up to 13dBm and the receive sensitivity is -96dBm, which effectively improves the stability of the audio connection. In the case of playing normal music, the no-load power consumption is as low as 4.xmA. 20 bands of audio PEQ, support music and call scene sound adjustment. Support dual connection, connects any two Bluetooth devices at the same time, which it is easy to switch. With low latency mode, that makes Bluetooth audio signal delay in low-latency mode as low as 50ms, users can enjoy high-fidelity sound at lower latency. In addition, owns single and dual microphone call AI noise reduction algorithm which greatly improves the users' call experience.
Now the main Bluetooth headset chips are ATS3015E、ATS3015S、ATS3019E、ATS3025、ATS3039.
Technical Spec PDF Download
|BT Version||V5.3 Dual Mode||V5.3 Dual Mode||V5.3 Dual Mode||V5.3 Dual Mode||V5.3 Dual Mode|
|CPU||32bit RISC@150MHz||32bit RISC@150MHz||32bit RISC@180MHz||M4F@96MHz + DSP@128MHz||M4F@96M + DSP@170MHz|
|SPI Norfash||8Mbits Flash||8Mbits Flash||8Mbits Flash||16Mbits Flash||16Mbits Flash|
|Tx Power||Max 11dbm||Max 11dbm||Max 11dbm||Max 13dbm||Max 13dbm|
|A2DP Consumption||6.x mA||6.x mA||6.x mA||4.x mA||4.x mA|
|PEQ||20 bands||20 bands||20 bands||20 bands||20 bands|
|Package||QFN32 (4X4mm) P2P ATS3015||QFN32 (4X4mm)||QFN36 (4X4mm)||QFN50(4X6mm)||QFN44(4X5mm)|
True wireless stereo headphones
Other Bluetooth wearable devices