Actions Bluetooth headset series products provide high integration and high performance Bluetooth audio single chip solutions, integrated Bluetooth radio frequency (RF) and baseband, power management unit (PMU), audio codec and MCU and other modules, using advanced semiconductor manufacturing process, lower power consumption, better RF performance. Mainly used in TWS headset, hearphone, game headset, business headset and other Bluetooth wearable devices.

The bluetooth Wearable series products adopt the architecture of single-core CPU and large capacity memory, and utilize the design technology of the leading low-voltage audio coding and decoding device and the hardware of the algorithm, which can not only guarantee the high sound quality and the noise reduction effect of high quality calls, but also achieve the purpose of reducing power consumption. The company's second generation Bluetooth headset chip ATS301X series has Bluetooth 5.0 dual mode configuration, the transmission power is up to 12dBm, the reception sensitivity is -95dbm, effectively improving the stability of audio connection. In the case of conventional audio playback, no-load power consumption is as low as 5. XmA, while low latency mode is supported, and bluetooth audio signal delay is as low as 40ms, which is in the leading level in the industry. It's a  very competitive solution for brand customers.

The Bluetooth headphone chips are mainly ATS3015/ATS3015P and ATS3019, among which ATS3019 supports dual microphone ENC.